DMC TSC-34/U-L Spécifications télécharger pdf (Page 21)

TSC-30/IC Product S

ecification

110

20s

175±10 °C 1 to 4 °C/s

220 °C or higher, 50s max.

255 °C or higher, 10s max.

260 °C max.

Time

Package’s surface temperature

200 °C or higher, 70s max.

8. Implementation Temperature Specification

We do not recommend the wave soldering method.

1. Reflow method (Infrared reflow, air reflow)

Frequency: Three times or less

Temperature: The following device surface temperature profile is recommended.

Figure 1: Infrared reflow, air reflow temperature profile

2. Soldering iron (Manual soldering)

Soldering bit’s temperature: 370 °C or lower

Soldering time: Five seconds or less/terminal

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DMC TSC-34/U-L Spécifications Page 21